Description
What is a high-performance 3G 4G LTE Antenna Flex PCB Embedded Antenna?
The High-performance 3G 4G LTE Antenna Flex PCB Embedded Antenna CTRF-ANTENNA-FPC-7027-4410-IPEX With Factory Price Flexible FPC 4G LTE FPCB Antenna With IPEX/UFL Connector 0.81 Cable 100mm manufactured by C&T RF Antennas Inc for embedded applications.
High-performance 3G 4G LTE Antenna Flex PCB Embedded Antenna product: 1, 3DBI Gain; 2, FPC Materials; 3, IPEX/UFL Connector; 4, 44x10mm FPC size; 5, RG 1.13 cable.
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High-performance 3G 4G LTE Antenna Flex PCB Embedded Antenna Are Available At C&T RF Antennas Inc.
Contact Us For High-performance 3G 4G LTE Antenna Flex PCB Embedded Antenna Inventory, High-performance 3G 4G LTE Antenna Flex PCB Embedded Antenna Pricing, and internal 3G 4G LTE Antenna Flex PCB Embedded Antenna Datasheets.
High-performance 3G 4G LTE Antenna Flex PCB Embedded Antenna Specifications:
High-performance 3G 4G LTE Antenna Flex PCB Embedded Antenna Electrical Specifications |
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| RF Antenna Type | Embedded FPC Antenna |
| Model | CTRF-ANTENNA-FPC-7027-4410-IPEX |
| Frequency | 700-960MHz, 1710-2700MHz |
| Gain | 2dBi/4dBi |
| VSWR | ≤2.0 |
| Impedance | 50 Ω |
| Polarization | Vertical/Linear |
| Cable Type | RG1.13 |
| Connector | U.FL/IPEX |
| Cable Length | 100mm |
| Lightning Protection | DC-Ground |
High-performance 3G 4G LTE Antenna Flex PCB Embedded Antenna Mechanical Specifications |
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| FPC Board Dimension | 44x10mm |
| Weight | Approx. 5g |
| Material | FPCB + RG Cable + U.FL connector |
| Operation Temperature | -40˚C~+65˚C |
| Storage Temperature | -40˚C~+70˚C |
| Color | Black |
| Antenna Design | Dipole Array |
| Mounting | Connector/Peel-and-Stick |
| Safety Emission and other | RoHS Compliant |
| Applications | ISM/SCADA/Utilities, IoT/M2M/NB-IoT/LoRa, 2G 3G 4G LTE/LTE-IoT, GSM GPRS UMTS, etc. |
High-performance Flexible PCB Antenna Features
High-performance Flexible PCB Antenna Applications
LTE, Long Term Evolution Technology
LTE is a follow-up development plan of UMTS technology in the field of wireless access formulated by 3GPP to meet the challenges of competing technologies such as WiMAX and future-oriented 4G technologies.
In 2004, 3GPP launched a long-term research plan including LTE to maintain the technological leadership of the UMTS technology system in the next 10 years.
The most notable feature of LTE is the use of OFDM (Orthogonal Frequency Division Multiplexing) technology and the use of 20MHz bandwidth. At the same time, it cooperates with the MIMO, high-order modulation, and enhanced RAKE reception and interference cancellation technology that has been used in HSPA+. , In order to reach the goal of 100Mbps down and 50Mbps up.
LTE is divided into two duplex modes, TDD and FDD.
In addition, from the perspective of network structure, the LTE wireless network will cancel the RNC node, each base station will be directly connected to the core network, and the network structure will be flat.
Therefore, although LTE is still claimed to be an evolution from the name, it is actually a subversion of WCDMA technology from a technical perspective.
At present, the standardization process of LTE is in progress. 3GPP has already included relevant LTE specifications since UMTS R8 (that is, in 2008).
In recent years, as major operators have become increasingly clear on the choice of post-3G communication technology, other technologies may stop developing or move closer to LTE technology.
The technology represented by LTE has gradually achieved the mainstream status of post-3G technology, which is very likely. Become the leader of 4G technology.
For example, the CDMA2000 1x technology system was originally planned to develop from 1x EV-DO to UMB (Ultra Mobile Broadband), but the plan has been abandoned and LTE has been adopted as the follow-up technology.
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